Product Description

   Feature:

   Good dispersion, Spherical shape, High degree of crystallinity, Good dispersion,

High tap density, Good fillibility,Good liquidity

   Application:

    Apply to conductive paste,HJTpaste,conductive printing ink, conductive resin, membrane switch and other intermediate and low-temperature paste, which can be instead of silver powder used in electronic industry.

    Product Specification:

    

Specification	Mean Particle Size(μm)	Specific Surface Area (m2/g)	Particle Size Distribution(μm)			Ag Content(wt%)
			D10	D50	D90
CuAg-S0501	0.8	1.50-2.50	≤1.00	≤2.00	≤4.00	20-30
CuAg-S1001	2.0	0.45-0.85	≤2.50	≤4.00	≤5.50	20-30
CuAg-S3501	3.0	0.25-0.45	≤3.80	≤6.00	≤9.30	20-30
CuAg-F0501	-	1.90-2.00	≤1.70	≤3.70	≤5.60	20-30
CuAg-F1001	-	0.80-0.95	≤3.20	≤4.80	≤6.30	20-30
CuAg-F3501	-	0.70-1.30	≤3.80	≤7.10	≤10.30	20-30

 

Different specifications of products can be customized.

* The letter ‘F’ in the specification means flake powder.

For more information,you can contact sales email:qgf@boqianpvm.com

Payment Terms︰ TT

Packing︰ Inner packaging aluminum foil bag, outer packaging cardboard box

Other specifications︰ CuAg30%-GB3501
CuAg20%-GB3501
CuAg30%-GB1001
CuAg20%-GB1001
CuAg30%-GB0501
CuAg20%-GB0501

Product Image