Feature:
Good dispersion, Spherical shape, High degree of crystallinity, Good dispersion,
High tap density, Good fillibility,Good liquidity
Application:
Apply to conductive paste,HJTpaste,conductive printing ink, conductive resin, membrane switch and other intermediate and low-temperature paste, which can be instead of silver powder used in electronic industry.
Product Specification:
|
Specification
|
Mean Particle Size(μm)
|
Specific Surface Area
(m2/g)
|
Particle Size Distribution(μm)
|
Ag Content(wt%)
|
|
D10
|
D50
|
D90
|
|
CuAg-S0501
|
0.8
|
1.50-2.50
|
≤1.00
|
≤2.00
|
≤4.00
|
20-30
|
|
CuAg-S1001
|
2.0
|
0.45-0.85
|
≤2.50
|
≤4.00
|
≤5.50
|
20-30
|
|
CuAg-S3501
|
3.0
|
0.25-0.45
|
≤3.80
|
≤6.00
|
≤9.30
|
20-30
|
|
CuAg-F0501
|
-
|
1.90-2.00
|
≤1.70
|
≤3.70
|
≤5.60
|
20-30
|
|
CuAg-F1001
|
-
|
0.80-0.95
|
≤3.20
|
≤4.80
|
≤6.30
|
20-30
|
|
CuAg-F3501
|
-
|
0.70-1.30
|
≤3.80
|
≤7.10
|
≤10.30
|
20-30
|
Different specifications of products can be customized.
* The letter ‘F’ in the specification means flake powder.
For more information,you can contact sales email:qgf@boqianpvm.com
